A perception seems to be developing that since the Nintendo Wii isn’t focused on exploiting the top end of the CPU power scale, it’s somehow underpowered compared to its next-gen competitors. Stories like this one often seem to position Wii as being all about “fun,” while XBox 360 and PlayStation 3 are all about “realism.” But as with many assumptions, it takes a fact and draws the wrong conclusion.

The “Broadway” chip inside Wii is a custom-built Power Architecture-based processor using Silicon-on-Insulator technology at 90 nanometers, and is built at our state-of-the art fab in East Fishkill (the same fab where our chips for XBox 360 and PlayStation 3 are made.) Some sophisticated advancements enable “Broadway” to deliver much higher performance while achieving a 20 percent reduction in power usage from earlier Nintendo processors.

Nintendo and IBM have collaborated for many years, going back to 1999 when IBM designed and built the chip for the first GameCube. Nintendo came to IBM with a very clear understanding of what they wanted to accomplish when they created the technical specs for Wii, and IBM worked with them to build a chip that met those objectives precisely. Many of the traits that make Wii as interactive and fun as it is are directly related to what’s inside the box.

Sony, Microsoft and Nintendo each have their own vision for the next generation of video games, and developed their technology in keeping with that vision. We’re insanely proud that we could work with all three of them, and help define the future of gaming. And if we’re asked which of our next-gen chips we “prefer,” the answer is simple: we love all our children equally!

Technorati tags: Wii, Nintendo, IBM